IDF: comes with USB 3.0
Ten times the speed increase over the previous standard.
Intel Corporation and other industry leaders have formed the USB 3.0 Promoter Group to create a super-fast USB “connection” capable of 5 Gbps - ten times the connectivity of today. The technology, developed in conjunction with HP, NEC Corporation, NXP Semiconductors, and Texas Instruments Incorporated, is primarily targeted at applications that enable fast synchronization (sync-and-go) in the personal computer, user, and mobile segments, as this is becoming increasingly important as digital media becomes more widespread and file sizes can reach up to 25 gigabytes.
USB (Universal Serial Bus) 3.0 will be a compatibility standard that is as easy to use with a plug-and-play solution as previous USB technologies. By targeting 5Gbps bandwidth, the technology will resemble a wired USB architecture. In addition, the USB 3.0 specification has been optimized for low power consumption and greater efficiency.
“USB 3.0 is the next logical step in popular wired connectivity for PCs,” said Jeff Ravencraft, Intel’s technology strategist and president of the USB Developer Forum. “In the digital age, we need high performance, reliable connectivity to be able to move huge digital content on a daily basis. USB 3.0 responds to this challenge while maintaining the ease of use that users already love and expect from USB technology. ”
Intel has formed the USB 3.0 Promoter Group to allow the USB Implementers Forum (USB-IF) to act as a professional association for the USB 3.0 specification. The updated USB 3.0 specification is expected in the first half of 2008.
