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According to TSMC, 20 sqm production may come next year

Taiwan Semiconductor Manufacturing Company (TSMC) plans to introduce 2013nm manufacturing technology as early as 20.
TSMC-to-Invest-in-RD-European-Base-at-IMEC-2 The head of the company stated that production in a larger volume may start in 2014, but they will be able to produce in limited quantities next year. According to Morris Chang, this will reduce the risks involved in production.

It also turned out that the engineers only offer a 20nm node, but it adapts well to a wide range of needs. This is definitely an interesting development, as TSMC has presented four solutions for 28 nm production: 28LP (poly / SION) low power consumption and cost efficiency, 28HPL (HKMG) low power consumption, 28HP (HKMG) for high performance chips and 28HPM (HKMG), which it combines high performance with relatively modest power requirements. 20 nm production no longer offers so many possibilities.

TSMC also confirmed that in the second half of 2015, the launch of a 16 nm node is expected to be available with FinFET technology.

Source: xbitlabs.com
 

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