Ivy Bridge processors are really hot-headed

Intel has acknowledged that third-generation Core i7 processors are warming up more than previous solutions.

Based on 22nm manufacturing technology, the Ivy Bridge architecture has been impeccable in almost every way, but it is surprising from tests, but the Intel Core i7-3770K can be warmer than the Core i7-2700k even with lower power consumption. The difference is not dramatic at all, it can be made at roughly 10 degrees. Researching the possible causes, it emerged that the processor giant is making some design flaws by placing poor quality thermal paste between the core and the cap, but this proved to be a mistake. The explanation is much simpler and more logical than that. Due to the 22 nm band width, the physical extent of the insert is much smaller than for 32 nm Sandy Bridge based products. This is extremely advantageous in terms of manufacturing costs, but it impairs heat conduction, as the amount of heat produced by the processor now has to be dissipated on a much more modest surface area.

Using a somewhat similar example: there is also a variant of the Radeon HD 6970 and GeForce GTX 570 cards that got the ASUS DirectCU II cooler. According to German-language ComputerBase measurements, the consumption of the two controllers is at a similar level, but AMD's solution was warmer even with higher noise emissions, the rival product. Observing the chip size, it turns out that the Cayman 389 and the GF110 chip are 520 square millimeters. This is probably the reason for the difference.

Ivy Bridge processors are not technically flawed at all, but simply not even Intel can break its laws of physics. By default, products move extensively within the safe operating range, but a possible overdrive can actually be hampered by the smaller insert size.

Source: theinquirer.net