Intel is preparing for a major technological step

The giant wants to replace the 300mm wafers with 450mm after ten years.

Intel wants to implement another major technology development, which is to replace the current 300mm silicon wafers with 450mm. I want to accomplish this in 2013 when production begins at a brand new facility called D1X in Oregon. Mark Bohr, head of manufacturing technology development at Intel, said the Fab D1X will be the first complex to be compatible with 450mm waffles.

Current 300mm production began in 2003 with 90nm chips, so the next bigger leap will happen in exactly 10 years. 450mm waffles will allow for significantly lower prices due to lower manufacturing costs. The D1X facility will be connected directly to the current D1D building, as can be seen in the image below.

The D1X complex is attached to the D1D.