G.Skill introduces new memory cooling

The mid-range and high-end modules are responsible for the aluminum cooling, simply named Pi.

Thanks to the larger heat-dissipating surface and the specially designed ventilation holes, the temperature of the memory chips can be kept 20-30% lower than that of conventional aluminum coolers that are "strained onto" the module.

Pi is deployed on the following G.Skill memory packages:

• F2-6400CL4D-2GBPI: DDR2-800 MHz, 4-4-4-12, 2 × 1 GB
• F2-8000CL5D-2GBPI: DDR2-1000 MHz, 5-5-5-15, 2 × 1 GB
• F2-8500CL5D-2GBPI: DDR2-1066 MHz, 5-5-5-15, 2 × 1 GB
• F2-6400CL5D-4GBPI: DDR2-800 MHz, 5-5-5-15, 2 × 2 GB
• F2-6400CL4D-4GBPI: DDR2-800 MHz, 4-4-4-12, 2 × 2 GB
• F2-8000CL5D-4GBPI: DDR2-1000 MHz, 5-5-5-15, 2 × 2 GB
• F2-8500CL5D-4GBPI: DDR2-1066 MHz, 5-5-5-15, 2 × 2 GB
• F3-10600CL8D-2GBPI: DDR3-1333 MHz, 8-8-8-21, 2 × 1 GB
• F3-10600CL8D-4GBPI: DDR3-1333 MHz, 8-8-8-21, 2 × 2 GB
• F3-10600CL7D-2GBPI: DDR3-1333 MHz, 7-7-7-18, 2 × 1 GB
• F3-10600CL7D-4GBPI: DDR3-1333 MHz, 7-7-7-18, 2 × 2 GB
• F3-12800CL7D-2GBPI: DDR3-1600 MHz, 7-7-7-18, 2 × 1 GB
• F3-12800CL7D-4GBPI: DDR3-1600 MHz, 7-7-7-18, 2 × 2 GB