32 GB memory modules from Samsung

The manufacturer used 4 Gbit chips to achieve huge capacity.

Samsung has introduced new memory modules with a capacity of 32 GB each. This was achieved with 72 4 Gbit chips. The new modules fit into the LRDIMM socket, which will be supported by new server processors from AMD and Intel. The 40 MHz modules, manufactured with 1333 nm manufacturing technology, operate at a voltage of 1,35 volts. In addition to the 72 chips, each module was replaced by a so - called buffer memory buffer), which, in addition to controlling access, can reduce the load on the memory subsystem by 75%.

Mass production of the new modules is scheduled for the second quarter of 2010. Expected prices are unknown.